Selective laser sintering has similar properties to the SLA process. SLS uses the print area that is filled with material during the workflow. At the same time, the laser is used to fix the model by layers.

If you look at the differences between SLS and SLA, SLA uses liquid resin as a material, while SLS works with powdered plastic. If the device has high power, then SLS uses metal.

This process is unique. It can be used to solve a number of maintenance problems. Here are some things to keep in mind.

Unsupported features

SLS printing has certain peculiarities. The safe powder surrounding the model automatically supports the printed component. This means that no additional supports are required. Models with complex geometries may require post-processing to remove support structures.

Hollow spaces

In SLS, as with SLA, complex internal structures and any voids in the parts contain residual powder after printing. Unlike resin, powder is difficult to remove, so it is better to create entire hollow parts. It is also possible to provide free access to the inside to remove uncured powder.

Durability and accuracy

Compared to SLA, where models are more fragile, SLS printed parts are distinguished by their durability. With the help of fine SLS powder, it is possible to create highly detailed models, unlike FDM. The created models have higher strength, as it is printed in one piece and consists of thinner rather than coarse extruded layers. If you plan to print a model using SLS, the model can be made more aesthetically pleasing, lightweight, and streamlined.

Interlocking parts

The problem of interlocking parts can be noted here. A locking joint requires a tolerance or gap between the parts to be joined. If the gap is filled with powdered material, as in SLS, this causes an uneven connection.

If the tolerance is small, the sintering of the material can cause several grains separating the parts to be joined to straighten. The problem can be solved by leaving an additional gap between the parts or by designing products that will be assembled later.